On 25 April, TSMC said its new A16 wafer technology will begin mass production by the end of 2026, marking a significant advancement in the company's process technology that will further strengthen its leadership position in the semiconductor industry.The introduction of the A16 process will mean improved wafer performance and lower power consumption.

TSMC's A16 wafer process technology represents the next stage in the development of the company's semiconductor technology, with the goal of increasing wafer density and efficiency to provide customers with more competitive products. TSMC's move demonstrates that they are proactively responding to future market demands and continuing to provide leading-edge process technology.

TSMC's A16 process plan could have a significant impact on the semiconductor market. The launch of this technology is expected to enhance TSMC's competitiveness in the global semiconductor manufacturing sector. The company has partnered with a number of international technology giants, including Apple (AAPL), NVIDIA (NVDA) and others, and this new process technology is likely to further cement these partnerships.